- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/528 - Layout of the interconnection structure
Patent holdings for IPC class H01L 23/528
Total number of patents in this class: 10766
10-year publication summary
|
572
|
1020
|
1448
|
1201
|
1191
|
1274
|
1305
|
1283
|
1389
|
523
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
2310 |
| Samsung Electronics Co., Ltd. | 131630 |
1219 |
| International Business Machines Corporation | 60644 |
615 |
| Intel Corporation | 45621 |
515 |
| Micron Technology, Inc. | 24960 |
512 |
| Kioxia Corporation | 9847 |
403 |
| SK Hynix Inc. | 11030 |
332 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
242 |
| Qualcomm Incorporated | 76576 |
219 |
| Sandisk Technologies LLC | 5684 |
218 |
| Renesas Electronics Corporation | 6305 |
172 |
| Yangtze Memory Technologies Co., Ltd. | 1940 |
164 |
| Nanya Technology Corporation | 2000 |
163 |
| Changxin Memory Technologies, Inc. | 4732 |
154 |
| United Microelectronics Corp. | 3921 |
149 |
| Texas Instruments Incorporated | 19376 |
114 |
| Macronix International Co., Ltd. | 2562 |
110 |
| Infineon Technologies AG | 8189 |
76 |
| Socionext Inc. | 1575 |
67 |
| Tessera LLC | 246 |
59 |
| Other owners | 2953 |